 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| 19-3572; Rev 0; 4/05 ABLE KIT AVAIL ALUATION EV High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator General Description The MAX2022 low-noise, high-linearity, direct upconversion quadrature modulator is designed for single and multicarrier 1800MHz to 2200MHz UMTS/WCDMA, cdma2000(R), and DCS/PCS base-station applications. Direct upconversion architectures are advantageous since they significantly reduce transmitter cost, part count, and power consumption as compared to traditional IF-based double upconversion systems. In addition to offering excellent linearity and noise performance, the MAX2022 also yields a high level of component integration. This device includes two matched passive mixers for modulating in-phase and quadrature signals, three LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. The MAX2022 operates from a single +5V supply. It is available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range. o o o o o o o Features 1500MHz to 2500MHz RF Frequency Range Meets Four-Carrier WCDMA 65dBc ACLR +23.3dBm Typical OIP3 +51.5dBm Typical OIP2 45.7dBc Typical Sideband Suppression -40dBm Typical LO Leakage -173.2dBm/Hz Typical Output Noise, Eliminating the Need for an RF Output Filter o Broadband Baseband Input o DC-Coupled Input Provides for Direct Launch DAC Interface, Eliminating the Need for Costly I/Q Buffer Amplifiers MAX2022 Ordering Information PART MAX2022ETX MAX2022ETX-T MAX2022ETX+D TEMP RANGE -40C to +85C -40C to +85C -40C to +85C PIN-PACKAGE PKG CODE 36 Thin QFN-EP* T3666-2 (6mm x 6mm) 36 Thin QFN-EP* T3666-2 (6mm x 6mm) 36 Thin QFN-EP* T3666-2 (6mm x 6mm) 36 Thin QFN-EP* T3666-2 (6mm x 6mm) Applications Single and Multicarrier WCDMA/UMTS Base Stations Single and Multicarrier cdmaOneTM and cdma2000 Base Stations Single and Multicarrier DCS 1800/PCS 1900 EDGE Base Stations PHS/PAS Base Stations Predistortion Transmitters Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radio ACLR AND ALT CLR (dBc) MAX2022ETX+TD -40C to +85C *EP = Exposed paddle. + = Lead free. -T = Tape-and-reel package. D = Dry pack. WCDMA, ACLR, ALTCLR and Noise vs. RF Output Power at 2140MHz for Single, Two, and Four Carriers -60 -62 -64 -66 -68 -70 -72 -74 -76 -78 -80 -50 -40 -30 -20 -10 0 1C ALT NOISE FLOOR -175 RF OUTPUT POWER PER CARRIER (dBm) 2C ALT 1C 4C 2C -165 2C ADJ 1C ADJ -155 -145 4C ADJ 4C ALT -135 NOISE FLOOR (dBm/Hz) -125 Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 ABSOLUTE MAXIMUM RATINGS VCC_ to GND ........................................................-0.3V to +5.5V COMP .............................................................................0 to VCC BBIP, BBIN, BBQP, BBQN to GND ............-2.5V to (VCC + 0.3V) LO, RFOUT to GND Maximum Current ...............................50mA Baseband Differential I/Q Input Power (Note A) ............+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current .............................................10mA RBIASLO2 Maximum Current .............................................10mA RBIASLO3 Maximum Current .............................................10mA JA (without air flow) ......................................................34C/W JA (2.5m/s air flow) .........................................................28C/W JC (junction to exposed paddle) ...................................8.5C/W Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering 10s, non-lead free)...........+245C Lead Temperature (soldering 10s, lead free) ..................+260C Note A: Maximum reliable continuous power applied to the baseband differential port is +12dBm from an external 100 source. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q inputs terminated into 100 differential, LO input terminated into 50, RF output terminated into 50, R1 = 432, R2 = 562, R3 = 301, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER Supply Voltage Total Supply Current Total Power Dissipation SYMBOL VCC ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC CONDITIONS MIN 4.75 TYP 5.00 292 1460 MAX 5.25 342 1796 UNITS V mA mW AC ELECTRICAL CHARACTERISTICS (MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source, 0V common-mode input, PLO = 0dBm, 1900MHz fLO 2200MHz, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 301, TC = -40C to +85C. Typical values are at VCC = +5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential, fIQ = 1MHz, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER BASEBAND INPUT Baseband Input Differential Impedance BB Common-Mode Input Voltage Range Output Power RF OUTPUTS (fLO = 1960MHz) VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHz VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHz TC = +25C fIQ = 1MHz -2.5 -24 43 0 +1.5 V dBm SYMBOL CONDITIONS MIN TYP MAX UNITS Output IP3 21.8 dBm Output IP2 48.9 dBm Output Power -20.5 dBm 2 _______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator AC ELECTRICAL CHARACTERISTICS (continued) (MAX2022 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100 DC-coupled source, 0V common-mode input, PLO = 0dBm, 1900MHz fLO 2200MHz, 50 LO and RF system impedance, R1 = 432, R2 = 562, R3 = 301, TC = -40C to +85C. Typical values are at VCC = +5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential, fIQ = 1MHz, TC = +25C, unless otherwise noted.) (Note 1) PARAMETER Output Power Variation Over Temperature Output-Power Flatness ACLR (1st Adjacent Channel 5MHz Offset) LO Leakage Sideband Suppression Output Return Loss Output Noise Density LO Input Return Loss RF OUTPUTS (fLO = 2140MHz) VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHz VBBI, VBBQ = 547mVP-P differential per tone into 50, fBB1 = 1.8MHz, fBB2 = 1.9MHZ fmeas = 2060MHz, with each baseband input terminated in 50 SYMBOL CONDITIONS TC = -40C to +85C fLO = 1960MHz, sweep fBB, PRF flatness for fBB from 1MHz to 50MHz Single-carrier WCDMA (Note 2), RFOUT = -16dBm No external calibration, with each baseband input terminated in 50 No external calibration MIN TYP -0.004 0.6 70 -46.7 47.3 15.3 -173.4 10.1 MAX UNITS dB/C dB dBc dBm dBc dB dBm/Hz dB MAX2022 Output IP3 23.3 dBm Output IP2 51.5 dBm Output Power Output Power Variation Over Temperature Output-Power Flatness ACLR (1st Adjacent Channel 5MHz Offset) LO Leakage Sideband Suppression Output Return Loss Output Noise Density LO Input Return Loss fmeas = 2240MHz, with each baseband input terminated in 50 TC = -40C to +85C fLO = 2140MHz, sweep fBB, PRF flatness for fBB from 1MHz to 50MHz Single-carrier WCDMA (Note 2), RFOUT = -16dBm, fLO = 2GHz No external calibration, with each baseband input terminated in 50 No external calibration -20.8 -0.005 dBm dB/C 0.32 dB 70 -40.4 45.7 13.5 -173.2 18.1 dBc dBm dBc dB dBm/Hz dB Note 1: TC is the temperature on the exposed paddle. Note 2: Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complimentary cumulative distribution function. _______________________________________________________________________________________ 3 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Typical Operating Characteristics (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) ACLR vs. OUTPUT POWER MAX2022 toc01 ACLR vs. OUTPUT POWER MAX2022 toc02 ACLR vs. OUTPUT POWER -62 -64 -66 ADJACENT CHANNEL MAX2022 toc03 -60 -62 -64 -66 ACLR (dB) -68 -70 -72 -74 -76 -78 -80 -40 -30 -20 -10 0 OUTPUT POWER (dBm) ALTERNATE CHANNEL ADJACENT CHANNEL SINGLE CARRIER -60 -62 -64 -66 ACLR (dB) ADJACENT CHANNEL TWO CARRIER -60 ACLR (dB) -68 -70 -72 -74 -76 -78 -80 -40 -30 -20 -10 0 OUTPUT POWER (dBm) ALTERNATE CHANNEL -68 -70 -72 -74 -76 -78 -80 -50 -40 -30 -20 -10 OUTPUT POWER (dBm) FOUR CARRIER ALTERNATE CHANNEL OUTPUT POWER vs. LO FREQUENCY MAX2022 toc04 OUTPUT POWER vs. LO FREQUENCY MAX2022 toc05 OUTPUT POWER vs. LO FREQUENCY VI = VQ = 0.611VP-P DIFFERENTIAL -3 OUTPUT POWER (dBm) -4 VCC = 4.75V, 5.0V, 5.25V -5 -6 -7 -8 MAX2022 toc06 -2 VI = VQ = 0.611VP-P DIFFERENTIAL -3 OUTPUT POWER (dBm) -4 PLO = -3dBm, 0dBm, +3dBm -5 -6 -7 -8 1.5 1.7 1.9 2.1 2.3 -2 VI = VQ = 0.611VP-P DIFFERENTIAL -3 OUTPUT POWER (dBm) -4 -5 -6 TC = +85C -7 -8 TC = +25C TC = -40C -2 2.5 1.5 1.7 1.9 2.1 2.3 2.5 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) LO FREQUENCY (GHz) LO FREQUENCY (GHz) LO LEAKAGE vs. LO FREQUENCY MAX2022 toc07 LO LEAKAGE vs. LO FREQUENCY MAX2022 toc08 LO LEAKAGE vs. LO FREQUENCY -10 BASEBAND INPUTS TERMINATED IN 50 MAX2022 toc09 -10 BASEBAND INPUTS TERMINATED IN 50 -10 BASEBAND INPUTS TERMINATED IN 50 LO LEAKAGE (dBm) LO LEAKAGE (dBm) -30 -30 LO LEAKAGE (dBm) PLO = -3dBm, +3dBm TC = -40C, +85C -30 VCC = 4.75V, 5.0V -50 -50 -50 -70 PLO = 0dBm -70 TC = +25C -70 VCC = 5.25V -90 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) -90 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) -90 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) 4 _______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) IMAGE REJECTION vs. LO FREQUENCY MAX2022 toc10 IMAGE REJECTION vs. LO FREQUENCY MAX2022 toc11 IMAGE REJECTION vs. LO FREQUENCY fBB = 1MHz, VI = VQ = 112mVP-P 50 IMAGE REJECTION (dB) 40 VCC = 4.75, 5.0V, 5.25V 30 20 10 0 MAX2022 toc12 60 fBB = 1MHz, VI = VQ = 112mVP-P 50 IMAGE REJECTION (dB) 40 TC = -40C, +25C, +85C 30 20 10 0 1.5 1.7 1.9 2.1 2.3 60 fBB = 1MHz, VI = VQ = 112mVP-P 50 IMAGE REJECTION (dB) PLO = -3dBm 40 PLO = 0dBm 30 20 PLO = +3dBm 10 0 60 2.5 1.5 1.7 1.9 2.1 2.3 2.5 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) LO FREQUENCY (GHz) LO FREQUENCY (GHz) OUTPUT NOISE vs. OUTPUT POWER PLO = 0dBm, fLO = 1960MHz -155 OUTPUT NOISE (dBm/Hz) -160 -165 TC = +85C -170 -175 -180 -25 -20 -15 -10 -5 0 5 10 OUTPUT POWER (dBm) TC = -40C TC = +25C AMX2022 toc13 OUTPUT NOISE vs. OUTPUT POWER PLO = 0dBm, fLO = 2140MHz -160 OUTPUT NOISE (dBm/Hz) -164 -168 -172 -176 TC = -40C -180 -25 -20 -15 -10 -5 0 5 10 OUTPUT POWER (dBm) AMX2022 toc14 IF FLATNESS vs. BASEBAND FREQUENCY -15 -16 IF POWER (dBm) -17 -18 -19 -20 -21 -22 -23 -24 0 20 40 60 80 100 BASEBAND FREQUENCY (MHz) fLO = 1960MHz, PBB = -12dBm/PORT INTO 50 fLO + fRF fLO - fRF MAX2022 toc15 -150 -156 -14 TC = +85C TC = +25C IF FLATNESS vs. BASEBAND FREQUENCY MAX2022 toc16 BASEBAND DIFFERENTIAL INPUT RESISTANCE vs. BASEBAND FREQUENCY BASEBAND DIFFERENTIAL INPUT RESISTANCE () BASEBAND DIFFERENTIAL INPUT RESISTANCE () MAX2022 toc17 BASEBAND DIFFERENTIAL INPUT RESISTANCE vs. BASEBAND FREQUENCY MAX2022 toc18 -14 -15 -16 IF POWER (dBm) -17 -18 -19 -20 -21 -22 -23 -24 0 20 40 60 80 fLO = 2140MHz, PBB = -12dBm/PORT INTO 50 fLO + fRF fLO - fRF 45.0 44.5 44.0 43.5 43.0 42.5 42.0 41.5 41.0 0 20 40 60 80 fLO = 2GHz, PLO = 0dBm VCC = 5.0V VCC = 5.25V VCC = 4.75V 44.5 44.0 PLO = +3dBm 43.5 43.0 PLO = -3dBm PLO = 0dBm fLO = 2GHz, VCC = 5.0V 42.5 0 20 40 60 80 100 BASEBAND FREQUENCY (MHz) 100 100 BASEBAND FREQUENCY (MHz) BASEBAND FREQUENCY (MHz) _______________________________________________________________________________________ 5 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) OUTPUT IP3 vs. LO FREQUENCY MAX2022 toc19 OUTPUT IP3 vs. LO FREQUENCY MAX2022 toc20 OUTPUT IP3 vs. LO FREQUENCY MAX2022 toc21 25 25 25 20 TC = -40C, +25C, +85C OIP3 (dBm) 20 VCC = 5.0V, 5.25V 15 VCC = 4.75V OIP3 (dBm) 20 PLO = -3dBm PLO = 0dBm, +3dBm 15 OIP3 (dBm) 15 10 10 10 5 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 0 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) 5 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 0 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) 5 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 0 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) OUTPUT IP3 vs. COMMON-MODE BASEBAND VOLTAGE MAX2022 toc22 OUTPUT IP2 vs. LO FREQUENCY MAX2022 toc23 OUTPUT IP2 vs. LO FREQUENCY VCC = 4.75V, 5.0V MAX2022 toc24 60 50 40 OIP3 (dBm) VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 70 60 50 OIP2 (dBm) 40 30 20 10 0 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 1.5 1.7 1.9 2.1 2.3 TC = +25C TC = +85C 70 60 50 OIP2 (dBm) TC = -40C 40 30 20 10 0 30 20 fLO = 2140MHz VCC = 5.25V fLO = 1960MHz 10 0 -3 -2 -1 0 1 2 3 COMMMON-MODE BASEBAND VOLTAGE (V) VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 1.5 1.7 1.9 2.1 2.3 2.5 2.5 LO FREQUENCY (GHz) LO FREQUENCY (GHz) OUTPUT IP2 vs. LO FREQUENCY MAX2022 toc25 OUTPUT IP2 vs. COMMON-MODE BASEBAND VOLTAGE MAX2022 toc26 LO LEAKAGE vs. LO FREQUENCY NULLED AT fLO = 1960MHz AT PRF = -18dBm -20 LO LEAKAGE (dBm) MAX2022 toc27 70 60 50 OIP2 (dBm) PLO = +3dBm 60 fLO = 1960MHz 50 fLO = 2140MHz 40 OIP2 (dBm) 0 40 30 20 10 0 1.5 PLO = -3dBm PLO = 0dBm -40 30 20 -60 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 1.7 1.9 2.1 2.3 2.5 10 0 -3 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz -2 -1 0 1 2 3 -80 -100 1.945 1.950 1.955 1.960 1.965 1.970 1.975 LO FREQUENCY (GHz) COMMMON-MODE BASEBAND VOLTAGE (V) LO FREQUENCY (GHz) 6 _______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) LO LEAKAGE vs. PRF WITH LO LEAKAGE NULLED AT SPECIFIC PRF MAX2022 toc28 LO LEAKAGE vs. PRF WITH LO LEAKAGE NULLED AT SPECIFIC PRF -70 -72 LO LEAKAGE (dBm) -74 -76 -78 -80 -82 -84 -86 -88 -90 NULLED AT -14dBm, -18dBm, -22dBm NULLED AT -10dBm fLO = 2140Hz MAX2022 toc29 LO LEAKAGE vs. fLO WITH LO LEAKAGE NULLED AT SPECIFIC PRF -10 -20 LO LEAKAGE (dBm) -30 -40 -50 -60 -70 -80 -90 fLO = 1960MHz, NULLED AT -10dBm PRF 1.85 1.90 1.95 2.00 2.05 2.10 LO FREQUENCY (GHz) MAX2022 toc30 -68 -70 -72 LO LEAKAGE (dBm) -74 -76 -78 -80 -82 -84 -86 -88 -90 -40 -35 -30 -25 -20 -15 fLO = 1960MHz NULLED AT -14dBm, -18dBm, -22dBm NULLED AT -10dBm -68 0 -10 -40 -35 -30 -25 -20 -15 -10 OUTPUT POWER PRF (dBm) OUTPUT POWER PRF (dBm) LO LEAKAGE vs. fLO WITH LO LEAKAGE NULLED AT SPECIFIC PRF MAX2022 toc31 LO LEAKAGE vs. DIFFERENTIAL DC OFFSET ON Q-SIDE MAX2022 toc32 SIDEBAND SUPRESSION vs. PRF 60 SIDEBAND SUPPRESSION (dB) 50 40 30 20 10 fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 1960MHz, 1.8MHz BASEBAND TONE NULLED AT PRF = -20dBm -30 -25 -20 -15 -10 9MHz MAX2022 toc33 0 -10 -20 LO LEAKAGE (dBm) -30 -40 -50 -60 -70 -80 -90 2.00 2.05 2.10 2.15 2.20 fLO = 2140MHz, NULLED AT -10dBm PRF -40 PRF = -18dBm, I-SIDE NULLED -50 LO LEAKAGE (dBm) fLO = 2140MHz fLO = 1960MHz 70 1.8MHz -60 -70 -80 2.25 -15 -14 -13 -12 -11 -10 -9 -8 LO FREQUENCY (GHz) DC DIFFERENTIAL OFFSET ON Q-SIDE (mV) 0 MODULATOR POUT (dBm) SIDEBAND SUPRESSION vs. PRF MAX2022 toc34 RF PORT RETURN LOSS vs. LO FREQUENCY MAX2022 toc35 LO PORT RETURN LOSS vs. LO FREQUENCY MAX2022 toc36 70 60 SIDEBAND SUPPRESSION (dB) 50 40 30 20 10 0 -30 -25 -20 -15 fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 2140MHz, 1.8MHz BASEBAND TONE NULLED AT PRF = -20dBm 1.8MHz 9MHz 0 0 -5 -10 -15 -20 -25 VCC = 4.75V, 5.0V, 5.25V RF PORT RETURN LOSS (dB) -5 -10 VCC = 4.75V, 5.0V, 5.25V -15 LO PORT RETURN LOSS (dB) -20 -10 1.5 1.7 1.9 2.1 2.3 2.5 MODULATOR POUT (dBm) LO FREQUENCY (GHz) -30 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) _______________________________________________________________________________________ 7 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50 LO input, R1 = 432, R2 = 562, R3 = 301, VCC = +5V, PLO = 0dBm, VIFI = VIFQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100 DC-coupled source, common-mode input from 0V, TC = +25C, unless otherwise noted.) LO PORT RETURN LOSS vs. LO FREQUENCY MAX2022 toc37 OUTPUT POWER vs. INPUT POWER (PIN*) MAX2022 toc38 OUTPUT POWER vs. INPUT POWER (PIN*) 8 6 OUTPUT POWER (dBm) 4 2 0 -2 -4 -6 -8 -10 TC = -40C, +25C, +85C PLO = 2140MHz *PIN IS THE AVAILABLE POWER FROM ONE OF THE FOUR 50 BASEBAND SOURCES MAX2022 toc39 0 -5 LO PORT RETURN LOSS (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 1.5 1.7 1.9 2.1 2.3 PLO = +3dBm PLO = -3dBm PLO = 0dBm 10 8 6 OUTPUT POWER (dBm) 4 2 0 -2 -4 -6 -8 -10 TC = -40C, +25C, +85C fLO = 1960MHz *PIN IS THE AVAILABLE POWER FROM ONE OF THE FOUR 50 BASEBAND SOURCES 10 2.5 -2 3 8 13 18 -2 3 8 13 18 LO FREQUENCY (GHz) INPUT POWER (PIN*) (dBm) INPUT POWER (PIN*) (dBm) TOTAL SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2022 toc40 VCCLOA SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2022 toc41 VCCLOI1 SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2022 toc42 340 90 VCCLOA SUPPLY CURRENT (mA) 85 80 75 70 65 60 VCC = 5.0V VCC = 4.75V VCC = 5.25V 55 VCCLOI1 SUPPLY CURRENT (mA) TOTAL SUPPLY CURRENT (mA) 320 VCC = 5.25V 300 50 VCC = 5.25V 45 280 VCC = 5.0V 260 VCC = 4.75V 240 -40 -15 10 35 60 85 TEMPERATURE (C) 40 VCC = 4.75V 35 VCC = 5.0V 30 -40 -15 10 35 60 85 -40 -15 10 35 60 85 TEMPERATURE (C) TEMPERATURE (C) VCCLOI2 SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2022 toc43 VCCLOQ1 SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2022 toc44 VCCLOQ2 SUPPLY CURRENT vs. TEMPERATURE (TC) MAX2022 toc45 70 VCCLOI2 SUPPLY CURRENT (mA) 65 60 55 50 45 40 -40 -15 10 35 60 VCC = 4.75V VCC = 5.0V VCC = 5.25V 55 VCCLOQ1 SUPPLY CURRENT (mA) 70 VCCLOQ2 SUPPLY CURRENT (mA) 65 60 55 50 45 40 VCC = 4.75V VCC = 5.0V VCC = 5.25V 50 VCC = 5.25V 45 VCC = 5.0V VCC = 4.75V 35 40 30 85 -40 -15 10 35 60 85 TEMPERATURE (C) TEMPERATURE (C) -40 -15 10 35 60 85 TEMPERATURE (C) 8 _______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator Pin Description PIN 1, 5, 9-12, 14, 16-19, 22, 24, 27-30, 32, 34, 35, 36 2 3 4 6 7 8 13 15 20 21 23 25 26 31 33 EP NAME FUNCTION MAX2022 MAX2022 GND RBIASLO3 VCCLOA LO RBIASLO1 COMP RBIASLO2 VCCLOI1 VCCLOI2 BBIP BBIN RFOUT BBQN BBQP VCCLOQ2 VCCLOQ1 GND Ground 3rd LO Amplifier Bias. Connect a 301 resistor to ground. LO Input Buffer Amplifier Supply Voltage Local Oscillator Input. 50 input impedance. 1st LO Input Buffer Amplifier Bias. Connect a 432 resistor to ground. Compensation Capacitor Input. Connect a 22pF capacitor to ground. 2nd LO Amplifier Bias. Connect a 562 resistor to ground. I-Channel 1st LO Amplifier Supply Voltage I-Channel 2nd LO Amplifier Supply Voltage Baseband In-Phase Positive Input Baseband In-Phase Negative Input RF Output Baseband Quadrature Negative Input Baseband Quadrature Positive Input Q-Channel 1st LO Amplifier Supply Voltage Q-Channel 2nd LO Amplifier Supply Voltage Exposed Ground Paddle. The exposed paddle MUST be soldered to the ground plane using multiple vias. Detailed Description The MAX2022 is designed for upconverting differential in-phase (I) and quadrature (Q) inputs from baseband to a 1500MHz to 2500MHz RF frequency range. Applications include single and multicarrier 1800MHz to 2200MHz UMTS/WCDMA, cdma2000, and DCS/PCS base stations. Direct upconversion architectures are advantageous since they significantly reduce transmitter cost, part count, and power consumption as compared to traditional IF-based double upconversion systems. The MAX2022 integrates internal baluns, an LO buffer, a phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature combiner. Precision matching between the in-phase and quadrature channels, and highly linear mixers achieves excellent dynamic range, ACLR, 1dB compression point, and LO and sideband suppression, making it ideal for four-carrier WCDMA/UMTS operation. the LO input converts the single-ended LO signal to a differential signal at the LO buffer input. In addition, the internal balun matches the buffer's input impedance to 50 over the entire band of operation. The output of the LO buffer goes through a phase splitter, which generates a second LO signal that is shifted by 90 with respect to the original. The 0 and 90 LO signals drive the I and Q mixers, respectively. LO Driver Following the phase splitter, the 0 and 90 LO signals are each amplified by a two-stage amplifier to drive the I and Q mixers. The amplifier boosts the level of the LO signals to compensate for any changes in LO drive levels. The two-stage LO amplifier allows a wide input power range for the LO drive. While a nominal LO power of 0dBm is specified, the MAX2022 can tolerate LO level swings from -3dBm to +3dBm. LO Input Balun, LO Buffer, and Phase Splitter The MAX2022 requires a single-ended LO input, with a nominal power of 0dBm. An internal low-loss balun at I/Q Modulator The MAX2022 modulator is composed of a pair of matched double-balanced passive mixers and a balun. The I and Q differential baseband inputs accept signals from DC to beyond 100MHz with differential amplitudes 9 _______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 up to 2VP-P differential (common-mode input equals 0V). The wide input bandwidth allows for direct interface with the baseband DACs. No active buffer circuitry between the baseband DAC and the MAX2022 is required. The I and Q signals directly modulate the 0 and 90 LO signals and are upconverted to the RF frequency. The outputs of the I and Q mixers are combined through a balun to a singled-ended RF output. above 3.5MHz. For GSM, connecting a 1nF capacitor from COMP to ground is recommended for filtering out noise and frequency offsets above 600kHz. Baseband I/Q Input Drive The MAX2022 I and Q baseband inputs should be driven differentially for best performance. The baseband inputs have a 50 differential input impedance. The optimum source impedance for the I and Q inputs is 100 differential. This source impedance will achieve the optimal signal transfer to the I and Q inputs, and the optimum output RF impedance match. The MAX2022 can accept input power levels of up to +12dBm on the I and Q inputs. Operation with complex waveforms, such as CDMA or WCDMA carriers, utilize input power levels that are far lower. This lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. The peak signals must be kept below the compression level of the MAX2022. The input common-mode voltage should be confined to the -2V to +1.5V DC range. The MAX2022 is designed to interface directly with Maxim high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements. Such DACs include the MAX5875 series of dual DACs, and the MAX5895 dual interpolating DAC. These DACs have ground-referenced differential current outputs. Typical termination of each DAC output into a 50 load Applications Information LO Input Drive The LO input of the MAX2022 requires a single-ended drive at a 1500MHz to 2500MHz frequency. It is internally matched to 50. An integrated balun converts the singled-ended input signal to a differential signal at the LO buffer differential input. An external DC-blocking capacitor is the only external part required at this interface. The LO input power should be within the -3dBm to +3dBm range. COMP Pin The COMP pin is used to provide additional lowpass filtering to the bias circuit noise. An external capacitor can be used from the COMP pin to ground to reduce the close-in noise of the modulator. For UMTS, connecting a 22pF capacitor from the COMP pin to ground is recommended to filter out noise and frequency offsets MAX5895 DUAL 16-BIT INTERP DAC BBI 50 MAX2022 RF MODULATOR FREQ 50 50 I/Q GAIN AND OFFSET ADJUST LO 50 50 0 90 FREQ BBQ 50 50 Figure 1. MAX5895 DAC Interfaced with MAX2022 10 ______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator resistor to ground, and a 10mA nominal DC output current results in a 0.5V common-mode DC level into the modulator I/Q inputs. The nominal signal level provided by the DACs will be in the -12dBm range for a single CDMA or WCDMA carrier, reducing to -18dBm per carrier for a four-carrier application. The I/Q input bandwidth is greater than 50MHz at -0.1dB response. The direct connection of the DAC to the MAX2022 insures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. The DAC output can be passed through a lowpass filter to remove the image frequencies from the DAC's output response. The MAX5895 dual interpolating DAC can be operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high, remote frequency, easing the design of the baseband filters. The DAC's output noise floor and interpolation filter stopband attenuation are sufficiently good to insure that the 3GPP noise floor requirement is met for large frequency offsets, 60MHz for example, with no filtering required on the RF output of the modulator. Figure 1 illustrates the ease and efficiency of interfacing the MAX2022 with a Maxim DAC, in this case the MAX5895 dual 16-bit interpolating-modulating DAC. The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to optimize the LO leakage and sideband suppression of the MAX2022 quadrature modulator. -20dBm output power level. For higher output level signals, the noise floor will be determined by the internal LO noise level at approximately -162dBc/Hz. The I/Q input power levels and the insertion loss of the device will determine the RF output power level. The input power is the function of the delivered input I and Q voltages to the internal 50 termination. For simple sinusoidal baseband signals, a level of 89mVP-P differential on the I and the Q inputs results in an input power level of -17dBm delivered to the I and Q internal 50 terminations. This results in a -27dBm RF output power. MAX2022 MAX2022 Generation of WCDMA Carriers The MAX2022 quadrature modulator makes an ideal signal source for the generation of multiple WCDMA carriers. The combination of high OIP3 and exceptionally low output noise floor gives an unprecedented output dynamic range. The output dynamic range allows the generation of four WCDMA carriers in the UMTS band with a noise floor sufficiently low to meet the 3GPP specification requirements with no additional RF filtering. This promotes an extremely simple and efficient transmitter lineup. Figure 2 illustrates a complete transmitter lineup for a multicarrier WCDMA transmitter in the UMTS band. The MAX5895 dual interpolating-modulating DAC is operated as a baseband signal generator. For generation of four carriers of WCDMA modulation, and digital predistortion, an input data rate of 61.44 or 122.88Mbps can be used. The DAC can then be programmed to operate in x8 or x4 interpolation mode, resulting in a 491.52Msps output sample rate. The DAC will generate four carriers of WCDMA modulation RF Output The MAX2022 utilizes an internal passive mixer architecture. This enables a very low noise floor of -173.2dBm/Hz for low-level signals, below about MAX5895 MAX2022 RF-MODULATOR I I I/Q GAIN AND OFFSET ADJUST L-C FILTER +12dB MAX2057 TX OUTPUT Q Q SYNTH CLOCK Figure 2. Complete Transmitter Lineup for a Multicarrier WCDMA in the UMTS Band ______________________________________________________________________________________ 11 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator with an ACLR typically greater than 77dB under these conditions. The output power will be approximately -18dBm per carrier, with a noise floor typically less than -144dBc/Hz. The MAX5895 DAC has built-in gain and offset fine adjustments. These are programmable by a 3-wire serial logic interface. The gain adjustment can be used to adjust the relative gains of the I and Q DAC outputs. This feature can be used to improve the native sideband suppression of the MAX2022 quadrature modulator. The gain adjustment resolution of 0.01dB allows sideband nulling down to approximately -60dB. The offset adjustment can similarly be used to adjust the offset DC output of each I and Q DAC. These offsets can then be used to improve the native LO leakage of the MAX2022. The DAC resolution of 4 LSBs will yield nulled LO leakage of typically less than -50dBc relative to four-carrier output levels. The DAC outputs must be filtered by baseband filters to remove the image frequency signal components. The baseband signals for four-carrier operation cover DC to 10MHz. The image frequency appears at 481MHz to 491MHz. This very large frequency spread allows the use of very low-complexity lowpass filters, with excellent in-band gain and phase performance. The low DAC noise floor allows for the use of a very wideband filter, since the filter is not necessary to meet the 3GPP noise floor specification. The MAX2022 quadrature modulator then upconverts the baseband signals to the RF output frequency. The output power of the MAX2022 will be approximately -28dBm per carrier. The noise floor will be less than -169dBm/Hz, with an ACLR typically greater than 65dBc. This performance meets the 3GPP specification requirements with substantial margins. The noise floor performance will be maintained for large offset frequencies, eliminating the need for subsequent RF filtering in the transmitter lineup. The RF output from the MAX2022 is then amplified by a combination of a low-noise amplifier followed by a MAX2057 RF-VGA. This VGA can be used for lineup compensation for gain variance of transmitter and power amplifier elements. No significant degradation of the signal or noise levels will be incurred by this additional amplification. The MAX2057 will deliver an output MAX2022 power of -6dBm per carrier, 0dBm total at an ACLR of 65dB and noise floor of -142dBc/Hz. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed paddle MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lowerlevel ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX2022 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all V CC pins with 22pF and 0.1F capacitors placed as close to the pins as possible. The smallest capacitor should be placed closest to the device. To achieve optimum performance, use good voltagesupply layout techniques. The MAX2022 has several RF processing stages that use the various VCC pins, and while they have on-chip decoupling, off-chip interaction between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive coupling between stages may degrade stability. Exposed Pad RF/Thermal Considerations The EP of the MAX2022's 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the IC is mounted be designed to conduct heat from this contact. In addition, the EP provides a low-inductance RF ground path for the device. The exposed paddle (EP) MUST be soldered to a ground plane on the PC board either directly or through an array of plated via holes. An array of 9 vias, in a 3 x 3 array, is suggested. Soldering the pad to ground is critical for efficient heat transfer. Use a solid ground plane wherever possible. 12 ______________________________________________________________________________________ High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator Pin Configuration/Functional Diagram MAX2022 VCCLOQ1 GND GND VCCLOQ2 GND GND 29 GND GND 36 GND RBIASLO3 VCCLOA LO GND RBIASLO1 COMP RBIASLO2 GND 1 2 3 4 5 6 7 8 9 10 GND 35 34 33 32 31 30 28 27 26 25 GND BBQP BBQN GND RFOUT GND BBIN BBIP GND BIAS LO3 MAX2022 90 0 GND 24 23 22 21 20 19 18 GND BIAS LO1 BIAS LO2 11 GND 12 GND 13 VCCLOI1 14 GND 15 VCCLOI1 16 GND 17 GND THIN QFN Chip Information TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS Package Information For the latest package outline information, go to www.maxim-ic.com/packages. ______________________________________________________________________________________ 13 High-Dynamic-Range, Direct Upconversion 1500MHz to 2500MHz Quadrature Modulator MAX2022 Table 1. Component List Referring to the Typical Application Circuit COMPONENT C1, C3, C4, C6, C7, C10, C13 C2, C5, C8, C11, C12 C9 R1 R2 R3 VALUE 22pF 0.1F 1.2pF 432 562 301 DESCRIPTION 22pF 5%, 50V C0G ceramic capacitors (0402) 0.1F 10%, 16V X7R ceramic capacitors (0603) 1.2pF 0.1pF, 50V C0G ceramic capacitor (0402) 432 1% resistor (0402) 562 1% resistor (0402) 301 1% resistor (0402) Typical Application Circuit VCCLOQ1 VCC C12 0.1F C13 22pF VCCLOQ2 C10 22pF C11 0.1F VCC R3 301 GND RBIASLO3 VCC C2 0.1F C1 22pF C3 22pF GND RBIASLO1 R1 432 COMP C4 22pF RBIASLO2 R2 562 GND VCCLOA LO 1 2 3 4 5 6 7 8 9 GND 36 GND 35 GND 34 33 GND 32 GND 30 GND 29 28 GND 31 BIAS LO3 MAX2022 27 26 25 GND BBQP BBQN GND Q+ QC9 1.2pF 90 0 24 23 RFOUT BIAS LO1 22 21 GND BBIN BBIP GND II+ BIAS LO2 20 19 10 GND VCC 11 GND 12 GND 13 VCCLOI1 14 GND 15 VCCLOI2 16 GND 17 GND 18 GND VCC C5 0.1F C6 22pF C7 22pF C8 0.1F Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. |
Price & Availability of MAX2022
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |